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Proceedings Paper

Wafer bonding techniques for MEMS device packaging
Author(s): Shamin Ahmad; Sunil K. Taya; R. Gopal; M. K. Sharma; D. Krausman
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Proc. SPIE 5276, Device and Process Technologies for MEMS, Microelectronics, and Photonics III, ; doi: 10.1117/12.548711
Show Author Affiliations
Shamin Ahmad, Central Electronics Engineering Research Institute (India)
Sunil K. Taya, Central Electronics Engineering Research Institute (India)
R. Gopal, Central Electronics Engineering Research Institute (India)
M. K. Sharma, Central Electronics Engineering Research Institute (India)
D. Krausman, Sonix Inc. (United States)


Published in SPIE Proceedings Vol. 5276:
Device and Process Technologies for MEMS, Microelectronics, and Photonics III
Jung-Chih Chiao; Alex J. Hariz; David N. Jamieson; Giacinta Parish; Vijay K. Varadan, Editor(s)

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