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Proceedings Paper

The effects of varying substrate angle on feature quality in femtosecond laser ablation of ferrous alloys
Author(s): Jeremy A Palmer; Karen L. McDaniel; Marc F Harris; Ronald Lumia; Michelle L Griffith
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Paper Abstract

This paper presents the results of an experimental study to establish process parameters for repeatable, high quality ablated features in ferrous substrates using a Ti:sapphire femtosecond laser system. Initial trials with stainless steel substrates were conducted in ambient atmospheric conditions. Laser power and exposure parameters were varied, in addition to the angle of the substrate relative to the beam. Ablated holes were sectioned, and examined. Data was reduced according to the Taguchi/ANOVA method. The optimal process parameter set minimized the figures of merit for quality or accuracy of the ablated hole. In trials using pulsed ablations, high accuracy holes were associated with laser power greater than 600 mW, substrate angles of 30-45 degrees, and 1000 pulses. In the dwell experiments, high accuracy holes were achieved with a similar power level, and a 1-second dwell time. In contrast to the pulse results, a shallow substrate angle (30 degrees or less) yielded favorable results. In subsequent trials, kovar substrates were processed in a vacuum at constant fluence with a 1-second dwell time. A localized flow of nitrogen removed ablation products. Results were compared to those of the initial trial, leading to significant observations regarding the use of vacuum and secondary process gas.

Paper Details

Date Published: 20 September 2004
PDF: 11 pages
Proc. SPIE 5448, High-Power Laser Ablation V, (20 September 2004); doi: 10.1117/12.546084
Show Author Affiliations
Jeremy A Palmer, Sandia National Labs. (United States)
Karen L. McDaniel, Sandia National Labs. (United States)
Marc F Harris, Sandia National Labs. (United States)
Ronald Lumia, Univ. of New Mexico (United States)
Michelle L Griffith, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 5448:
High-Power Laser Ablation V
Claude R. Phipps, Editor(s)

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