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Proceedings Paper

Optical MEMS components fabrication using micromachning of (111)-oriented silicon wafers
Author(s): Dana Cristea; Elena Manea; Mihai Kusko
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Paper Abstract

This paper presents the experiments we have performed to obtain freestanding SiO2 and c-Si based microphotonic components by anisotropic wet etching of silicon (111) wafers. The process is simpler than surface micromachining. It requires only one grown or deposited layer and one mask for SiO2 structure, or two masks for c-Si structures. Moreover, the technique provides plan-parallel microstructure with very flat (111) surfaces, useful for photonic components like micromirrors and waveguides. Movable SiO2 and silicon-based micromirrors and waveguides with very smooth surfaces were obtained by anisotropic etching in a KOH solution combined with plasma etching. The possible applications of SiO2 and silicon based freestanding structures include devices for optical communications and bio- or chemo-optical sensors.

Paper Details

Date Published: 16 August 2004
PDF: 9 pages
Proc. SPIE 5455, MEMS, MOEMS, and Micromachining, (16 August 2004); doi: 10.1117/12.545022
Show Author Affiliations
Dana Cristea, National Institute for Research and Development in Microtechnologies (Romania)
Elena Manea, National Institute for Research and Development in Microtechnologies (Romania)
Mihai Kusko, National Institute for Research and Development in Microtechnologies (Romania)


Published in SPIE Proceedings Vol. 5455:
MEMS, MOEMS, and Micromachining
Hakan Urey; Ayman El-Fatatry, Editor(s)

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