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Proceedings Paper

Thickness measurement of thin transparent plates with a broadband wavelength-scanning interferometer
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Paper Abstract

A novel broad-band telecom laser source is used to realize a lateral-shear scanning-wavelength interferometer for measuring the thickness of thin plates. We show that the wide tunability range allows to detect samples down to tens of microns with a relative uncertainty of less than 0.5% and a resolution of about 1 nm. A comparable accuracy in the thickness characterization of double-layer structures is also demonstrated. In turn, the wide tunability range needs the dispersion law of the materials to be taken into account in the model for correct thickness evaluation.

Paper Details

Date Published: 17 August 2004
PDF: 7 pages
Proc. SPIE 5458, Optical Micro- and Nanometrology in Manufacturing Technology, (17 August 2004); doi: 10.1117/12.544955
Show Author Affiliations
Pasquale Maddaloni, Istituto Nazionale di Ottica Applicata (Italy)
Giuseppe Coppola, Istituto per la Microelettronica e Microsistemi, CNR (Italy)
Paolo de Natale, Istituto Nazionale di Ottica Applicata (Italy)
Sergio de Nicola, Istituto di Cibernetica, CNR (Italy)
Pietro Ferraro, Istituto Nazionale di Ottica Applicata (Italy)
Mariano Gioffre, Istituto per la Microelettronica e Microsistemi, CNR (Italy)
Mario Iodice, Istituto per la Microelettronica e Microsistemi, CNR (Italy)


Published in SPIE Proceedings Vol. 5458:
Optical Micro- and Nanometrology in Manufacturing Technology
Christophe Gorecki; Anand K. Asundi, Editor(s)

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