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Proceedings Paper

Toward redundant 2D VCSEL arrays for optical datacom
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Paper Abstract

We have developed technologies that bring functional redundancy to flip-chip mounted 850nm backside-emitting high-speed VCSEL arrays with 250μm channel pitch. A self-aligned dry-etch process results in vertical mesa sidewalls facilitating extremely narrow gaps as small as 2μm between adjacent mesas, and even smaller gaps seem possible with this technology. Very dense intra-cell arrangements of oxide-confined circular and pie-shaped VCSELs were fabricated with minimal current aperture center-to-center distances of 20μm and 17μm, respectively. The paper also gives a first theoretical approximation of the additional coupling loss introduced by the inevitable radial VCSEL--fiber displacement for a 10μm VCSEL coupling into a standard 50μm fiber channel under varying offset launch conditions. We also present 4x8 and 8x8 regular arrays directly hybridized onto silicon carrier chips by means of an indium solder based flip-chip technology. The elimination of thermal bottlenecks by direct mesa bonding cuts the thermal resistance by half to about 1.3K/mW for 10μm devices as compared to offset-bonded devices.

Paper Details

Date Published: 8 September 2004
PDF: 12 pages
Proc. SPIE 5453, Micro-Optics, VCSELs, and Photonic Interconnects, (8 September 2004); doi: 10.1117/12.544867
Show Author Affiliations
Hendrik Roscher, Univ. Ulm (Germany)
Rainer Michalzik, Univ. Ulm (Germany)


Published in SPIE Proceedings Vol. 5453:
Micro-Optics, VCSELs, and Photonic Interconnects
Hugo Thienpont; Kent D. Choquette; Mohammad R. Taghizadeh, Editor(s)

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