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Proceedings Paper

Application on multichannel V-groove inspection
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Paper Abstract

MOEMS packing architecture has been a major driving force for miniaturization of fiber optical components and optical communication devices. By using of bulk micromachining technology, V-grooves and micro-pits can be fabricated on a silicon wafer for coupling micro laser diode to fiber or fiber to fiber, and finally integrating into the small modules on chip packages. Because many factors, such as photolithography, material property, wet chemical etching process and operator's skills will influence the geometric accuracy, a precision measurement instrument is needed for in-situ inspection of V-grooves suitable for the critical passive optical alignments. This paper reported a novel 3D confocal profile measurement system for in-situ inspection of the depth of multi-channel V-grooves.

Paper Details

Date Published: 17 August 2004
PDF: 8 pages
Proc. SPIE 5458, Optical Micro- and Nanometrology in Manufacturing Technology, (17 August 2004); doi: 10.1117/12.544171
Show Author Affiliations
Chongxiang Li, Nanyang Technological Univ. (Singapore)
Anand Krishna Asundi, Nanyang Technological Univ. (Singapore)
Zhong Ping Fang, Singapore Institute of Manufacturing Technology (Singapore)

Published in SPIE Proceedings Vol. 5458:
Optical Micro- and Nanometrology in Manufacturing Technology
Christophe Gorecki; Anand K. Asundi, Editor(s)

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