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Proceedings Paper

Evaluation of optical path adhesive's behavior in high-power photonics applications
Author(s): Stephan L. Logunov; Michael E. DeRosa; Xinghua Li
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Paper Abstract

In this paper we present the result of a sensitive experimental technique used to provide information about the limitations of using organic polymers for fiber-optic high power applications. Optical path adhesives are commonly used in fiber optics assemblies due to their mechanical and optical properties. However, their use in high power applications creates certain concerns about short-term and long-term stability of the adhesive material. We developed an approach for evaluating the effects of high power in optical path adhesives used in applications for fiber-optic devices. We extended far field experimental technique for analysis on a thin polymer layer placed on the tip of an optical fiber exposed to a wide range of optical powers. We found that this technique can be used for both thermo-optical effects evaluation and electronic non-linear contributions to the refractive index of the material. We show how this method permits separation of these two effects, and long term behavior of polymer materials in such applications. This approach could be used for evaluation of wide range polymer materials in photonics.

Paper Details

Date Published: 10 September 2004
PDF: 8 pages
Proc. SPIE 5465, Reliability of Optical Fiber Components, Devices, Systems, and Networks II, (10 September 2004); doi: 10.1117/12.544157
Show Author Affiliations
Stephan L. Logunov, Corning Inc. (United States)
Michael E. DeRosa, Corning Inc. (United States)
Xinghua Li, Corning Inc. (United States)


Published in SPIE Proceedings Vol. 5465:
Reliability of Optical Fiber Components, Devices, Systems, and Networks II
Hans G. Limberger; M. John Matthewson, Editor(s)

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