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Proceedings Paper

High-quality microcutting in silicon by advanced laser technology
Author(s): E. Gallus; Paolo Castelli
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Paper Abstract

This paper reports on the potentialities of innovative lasers in microcutting of silicon, one of the most important materials in the field of microelectronics. In recent years, novel laser based micromachining methods have played an increasingly important role in the ongoing miniaturization of consumer electronics. Here, high-quality microcutting in silicon using a "green" laser, whose wavelength is readily absorbed by silicon, is presented.

Paper Details

Date Published: 14 November 2003
PDF: 9 pages
Proc. SPIE 5147, ALT'02 International Conference on Advanced Laser Technologies, (14 November 2003); doi: 10.1117/12.543736
Show Author Affiliations
E. Gallus, RTM S.p.A. (Italy)
Paolo Castelli, RTM S.p.A. (Italy)


Published in SPIE Proceedings Vol. 5147:
ALT'02 International Conference on Advanced Laser Technologies
Heinz P. Weber; Vitali I. Konov; Thomas Graf, Editor(s)

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