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Proceedings Paper

Open-window BH process for the fabrication of integrated photonic devices
Author(s): Yu Sun; Z. B. Chen; X. M. Ji; Fow-Sen Choa
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Paper Abstract

With the development of photonic devices technology, optical communication networks require highly integrated photonic devices. The key problems in integrated devices are how to integrate these active devices and passive devices together and achieve the low loss and high performance. In this paper, we are talking about a new processing technology to the integrated device which shows a great potential in the application of integrated devices. The basic idea is to use semi-insulating material as the buried heterostructure and cladding material at the same time, then open a hole on the active region to define and confine the current flow. We did lots of experiments to prove this method, and the results showed the feasibility. This new method can have wide applications not only on the issues of the integrated devices. It can be used in very narrow waveguide devices and other applications.

Paper Details

Date Published: 15 December 2003
PDF: 3 pages
Proc. SPIE 5260, Applications of Photonic Technology 6, (15 December 2003); doi: 10.1117/12.543710
Show Author Affiliations
Yu Sun, Univ. of Maryland/Baltimore County (United States)
Z. B. Chen, Univ. of Maryland/Baltimore County (United States)
X. M. Ji, Univ. of Maryland/Baltimore County (United States)
Fow-Sen Choa, Univ. of Maryland/Baltimore County (United States)

Published in SPIE Proceedings Vol. 5260:
Applications of Photonic Technology 6
Roger A. Lessard; George A. Lampropoulos, Editor(s)

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