Share Email Print
cover

Proceedings Paper

A low-cost thermal imaging sensor for networked applications
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The cost of thermal imaging technology has, up until now, precluded its use in networked sensor systems which require sensors to be deployed in very large numbers. Detectors based on the manufacturing processes used in the production of conventional silicon chips offer a breakthrough in cost compared to other technologies. Despite having modest performance, this technology offers a route toward a very cost-effective thermal imaging sensor for networked applications, where the limited performance of each individual sensor is less significant due to the advantage given by large numbers of sensors covering the target area. By carefully optimising the detector format, this low-cost technology is able to achieve useful performance at short ranges which are suited to a networked sensor system.

Paper Details

Date Published: 1 September 2004
PDF: 9 pages
Proc. SPIE 5417, Unattended/Unmanned Ground, Ocean, and Air Sensor Technologies and Applications VI, (1 September 2004); doi: 10.1117/12.543497
Show Author Affiliations
Paul A. Manning, QinetiQ Ltd. (United Kingdom)
Nick J. Parkinson, QinetiQ Ltd. (United Kingdom)


Published in SPIE Proceedings Vol. 5417:
Unattended/Unmanned Ground, Ocean, and Air Sensor Technologies and Applications VI
Edward M. Carapezza, Editor(s)

© SPIE. Terms of Use
Back to Top