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Proceedings Paper

Intel nanotechnology integrated process control systems: an overview
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Paper Abstract

As patterning dimensions decrease, die yield and performance become increasingly sensitive to smaller amounts of process variations. To minimize variability, Process Control is applied to prevent excursions, improve yield, decrease non-product runs, reduce cycle time due to rework, and reduce equipment calibration and maintenance. Intel inline Process Control aims at rapid detection, classification, prediction, and correction of problems and/or non-optimal performance during wafer processing. For efficient process control, robust analysis is needed in order to monitor the process, detect, and predict the process behavior. The paper will address Intel model based control and will focus on the various model based analysis and control modules that Intel has developed, and deployed for different technology generations. With the rapid increases in the number of analysis and control modules and the emerging need for integrating such modules to allow sharing of data, applications and methods, there is a need to define standard interfaces for such modules. This need motivated Intel to lead the development of SEMI E133; the Process Control Systems (PCS) Standard that was approved on October 2003.

Paper Details

Date Published: 29 April 2004
PDF: 9 pages
Proc. SPIE 5378, Data Analysis and Modeling for Process Control, (29 April 2004); doi: 10.1117/12.543298
Show Author Affiliations
Kumud Srinivasan, Intel Corp. (United States)
Youssry Botros, Intel Corp. (United States)


Published in SPIE Proceedings Vol. 5378:
Data Analysis and Modeling for Process Control
Kenneth W. Tobin, Editor(s)

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