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Proceedings Paper

Continuum simulation of adhesive-adherend interface layers for USNDE
Author(s): R. Yerikalapudy Vasudeva; Gopinathan Sudheer
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Paper Abstract

Characterization of effective interfacial properties in adhesive joints is one of the major challenges in NDE. The interlayer between the adhesive and the adherend is typically of the order of 1μm and even over this distance -- it is realized -- the interlayer could be a function of depth depending on adhesive penetration and pore formation on adherend surface affecting the ultimate bond strength. The thinness of this complex region is taken advantage of in the present work to treat it as a continuum with different length scales at micro and macro levels. The dispersion-attenuation of leaky guided waves is simulated to facilitate USNDE of this region.

Paper Details

Date Published: 21 July 2004
PDF: 11 pages
Proc. SPIE 5392, Testing, Reliability, and Application of Micro- and Nano-Material Systems II, (21 July 2004); doi: 10.1117/12.543241
Show Author Affiliations
R. Yerikalapudy Vasudeva, Andhra Univ. (India)
Gopinathan Sudheer, Gayatri Vidya Parishad College of Engineering (India)


Published in SPIE Proceedings Vol. 5392:
Testing, Reliability, and Application of Micro- and Nano-Material Systems II
Norbert Meyendorf; George Y. Baaklini; Bernd Michel, Editor(s)

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