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Proceedings Paper

Laser modification of structure and properties of glass-ceramics
Author(s): Vadim P. Veiko; Q. K. Kieu; Nikolay V. Nikonorov
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Paper Abstract

There are many phenomena that occur during laser radiation interaction with solids, one of them is hardening. In a broad sense of this word, it is a way to keep or to "froze" the high temperature structure of materials after being melted. Maybe the case of glass-ceramics laser hardening is one of the most impressive. Because the high temperature structure induced by laser radiation acting on these materials is mostly amorphous (the structure consists of 70-80% or even more glass phase)- keeping this structure means to save at room temperature optical properties of appeared glass, first of all -transmission, dispersion and very often optical force. Many aspects of the mentioned phenomenon were discussed in previous papers qualitatively [1, 2, 3]. In this paper we present quantitative data about rates of heating-cooling and corresponding changes in typical glass-ceramics such as cracking, amorphization, and reverse crystallization. The next aim of the paper is to illustrate changes in structural, chemical, mechanical, and optical properties due to laser radiation interaction with glass-ceramics. Thus, we demonstrated a way how to develop new materials with the use of laser modification of glass-ceramics.

Paper Details

Date Published: 15 July 2004
PDF: 8 pages
Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); doi: 10.1117/12.543047
Show Author Affiliations
Vadim P. Veiko, St. Petersburg Institute of Fine Mechanics and Optics (Russia)
Q. K. Kieu, St. Petersburg Institute of Fine Mechanics and Optics (Russia)
Nikolay V. Nikonorov, St. Petersburg Institute of Fine Mechanics and Optics (Russia)

Published in SPIE Proceedings Vol. 5339:
Photon Processing in Microelectronics and Photonics III
Jan J. Dubowski; Peter R. Herman; Friedrich G. Bachmann; Willem Hoving; Jim Fieret; David B. Geohegan; Frank Träger; Kunihiko Washio; Alberto Pique; Xianfan Xu; Tatsuo Okada, Editor(s)

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