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Proceedings Paper

1D InGaAs lock-in FPA
Author(s): Kangzhu Guo; Haijiang Ou; Thomas Grycewicz; Abhay Joshi; Xinde Wang; Gordon Thomas; Haimin Wang; Richard Greene; Durga Misra; Sheng Liu; Zhiwei Liu; Jianjun Zhen; Xiaodong Wang; Baoqing Li; Zhixiong Xiao; Nicholas A. Ciampa; Jan Opyrchal; Halina Opyrchal; Ken K. Chin
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Paper Abstract

A 1D IR lock-in focal plane array (FPA) for extremely weak signal imaging has been demonstrated. The experimental system consists of an object with modulated image signal, a high speed InGaAs linear photodetector array as receiver, a CMOS lock-in linear array read-out circuit, and a focal plane array test system. The system can detect extremely weak signals immersed in strong background. Preliminary test shows that under room temperature each of the pixels in the 1D lock-in FPA can read out modulated signal 5 orders smaller than the background. The InGaAs detector array response is from 0.8 μm to 1.6 μm (peak at 1.2 μm). The lock-in array read-out circuit uses a correlated multi-cycle integrator, which can operate in several modes such as gated integration, and phase-sensitive integration with background subtraction. The 1D lock-in FPA works as a pixel to pixel lock-in amplifier, wherein very small signals may be extracted from a much strong background if the frequency of the illuminating source (usually IR light sources) is known. Simulation results are also reported. Experimental results based on an IR illuminating source are demonstrated.

Paper Details

Date Published: 30 August 2004
PDF: 9 pages
Proc. SPIE 5406, Infrared Technology and Applications XXX, (30 August 2004); doi: 10.1117/12.542662
Show Author Affiliations
Kangzhu Guo, Rutgers Univ. (United States)
Haijiang Ou, New Jersey Institute of Technology (United States)
Thomas Grycewicz, U.S. Air Force, Defense Threat Reduction Agency (United States)
Abhay Joshi, Discovery Semiconductors, Inc. (United States)
Xinde Wang, Discovery Semiconductors, Inc. (United States)
Gordon Thomas, New Jersey Institute of Technology (United States)
Haimin Wang, New Jersey Institute of Technology (United States)
Richard Greene, New Jersey Institute of Technology (United States)
Durga Misra, New Jersey Institute of Technology (United States)
Sheng Liu, New Jersey Institute of Technology (United States)
Zhiwei Liu, New Jersey Institute of Technology (United States)
Jianjun Zhen, New Jersey Institute of Technology (United States)
Xiaodong Wang, New Jersey Institute of Technology (United States)
Baoqing Li, New Jersey Institute of Technology (United States)
Zhixiong Xiao, New Jersey Institute of Technology (United States)
Nicholas A. Ciampa, New Jersey Institute of Technology (United States)
Jan Opyrchal, New Jersey Institute of Technology (United States)
Halina Opyrchal, New Jersey Institute of Technology (United States)
Ken K. Chin, New Jersey Institute of Technology (United States)


Published in SPIE Proceedings Vol. 5406:
Infrared Technology and Applications XXX
Bjorn F. Andresen; Gabor F. Fulop, Editor(s)

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