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Proceedings Paper

Analysis of laser drilling process for substrate by optical simulation rectified at the ablation rate
Author(s): Katsuichi Ukita; Yasuhiro Mizutnai; Daisuke Yokohagi; Koki Ichihashi; Hidehiko Karasaki
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Paper Abstract

The shape of a processed hole is a key factor for laser drilling system. There are many studies to calculate the behavior of heat or the reaction of molecules in a substrate after laser irradiation. These simulations enable calculation of removed volume by laser power. However, there were some difficulties to estimate the shape of processed hole. To solve the problem, the shape of processed hole was calculated by optical simulation and the ablation rate. The laser intensity distribution on the substrate was calculated by optical simulation considered with diffraction of beam and the aberrations of optics. Furthermore the results of optical simulation were rectified by ablation rate. The calculated shape of the processed hole showed good agreement with actual. This simulation can be used to control the laser drilling process to realize high quality holes.

Paper Details

Date Published: 18 November 2003
PDF: 4 pages
Proc. SPIE 5063, Fourth International Symposium on Laser Precision Microfabrication, (18 November 2003); doi: 10.1117/12.541163
Show Author Affiliations
Katsuichi Ukita, Matsushita Industrial Equipment Co., Ltd. (Japan)
Yasuhiro Mizutnai, Matsushita Industrial Equipment Co., Ltd. (Japan)
Daisuke Yokohagi, Matsushita Industrial Equipment Co., Ltd. (Japan)
Koki Ichihashi, Matsushita Industrial Equipment Co., Ltd. (Japan)
Hidehiko Karasaki, Matsushita Industrial Equipment Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 5063:
Fourth International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Andreas Ostendorf; Koji Sugioka; Henry Helvajian, Editor(s)

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