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Proceedings Paper

Next-generation optoelectronic components enabled by direct-write microprinting technology
Author(s): Donald J. Hayes; Ting Chen
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Paper Abstract

Direct write microprinting technologies are now being developed and used across a wide spectrum of optoelectronic applications, because they provide opportunities for manufacturing a series of components in micrometer scales and in large array size with reduced cost. Micro-optic structures have been printed not only as stand-alone components, but also directly onto other active and passive components, such as VCSEL, photodiode, optical fiber, etc., to form high performance assemblies. These assemblies can be further integrated with electronic circuits via solder ball printing to construct miniature and high sensitivity sensing devices, such as photodiode array detector, fluorescence probe, etc. By implementing MEMS technologies, micro-clampers have also been developed for the alignment and packaging of miniature, multi-channel sensing devices.

Paper Details

Date Published: 3 August 2004
PDF: 8 pages
Proc. SPIE 5435, Enabling Photonic Technologies for Aerospace Applications VI, (3 August 2004); doi: 10.1117/12.541071
Show Author Affiliations
Donald J. Hayes, MicroFab Technologies, Inc. (United States)
Ting Chen, MicroFab Technologies, Inc. (United States)


Published in SPIE Proceedings Vol. 5435:
Enabling Photonic Technologies for Aerospace Applications VI
Andrew R. Pirich; Michael J. Hayduk; Eric Donkor, Editor(s)

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