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Surface modification of silicon and PTFE by laser surface treatment: improvement of wettability
Author(s): Dong-Yong Kim; Kyoung-cheol Lee; Cheon Lee
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Paper Abstract

Laser surface treatment was used to modify the surface of silicon and PTFE (polytetrafluoroethylene). This method is in order to improve its wettability and adhesion characteristics. Using a 4th harmonic Nd:YAG pulse laser (λ = 266 nm, pulse), we determined the wettability and the adhesion characteristics of silicon and PTFE surfaces developed by the laser irradiation. Particularly, surface treatment of PTFE was only effective when the irradiated interface was in contact with the triethylamine photoreagent. We investigated laser surface treatment of materials by the surface energy modification. By using the sessile drop technique with distilled water, we determined that the wettability of silicon and PTFE after the irradiation showed a decrease in the contact angle and a change in the surface chemical composition. In case of the laser-treated materials surface, laser direct writing of copper lines was achieved through pyrolytic decomposition of copper formate films by using a focused argon ion laser beam (λ = 514.5 nm, cw) on silicon and PTFE substrates. The deposited patterns and the surface chemical compositions were measured by using energy dispersive X-ray, scanning electron microscopy, X-ray photoelectron spectroscopy, and surface profiler to examine cross section of the deposited copper lines.

Paper Details

Date Published: 18 November 2003
PDF: 5 pages
Proc. SPIE 5063, Fourth International Symposium on Laser Precision Microfabrication, (18 November 2003); doi: 10.1117/12.541064
Show Author Affiliations
Dong-Yong Kim, Inha Univ. (South Korea)
Kyoung-cheol Lee, Inha Univ. (South Korea)
Cheon Lee, Inha Univ. (South Korea)

Published in SPIE Proceedings Vol. 5063:
Fourth International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Andreas Ostendorf; Koji Sugioka; Henry Helvajian, Editor(s)

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