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Proceedings Paper

Laser processing at solid-liquid interfaces using femtosecond pulse laser sources
Author(s): Kenji Katayama; Hideaki Yonekubo; Tsuguo Sawada
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Paper Abstract

Laser processing using light sources with ultrashort pulses was applied to solid/liquid interfaces. A single-shot 200-fs pulse light was simply focused and irradiated or two pulses were interfered and irradiated at a water or electrolyte solution/silicon interface. From the measured AFM images on the processed silicon surfaces, several features were revealed, which were characteristic of the laser processing at the solid/liquid interface. First, ring patterns surrounded by sinusoidal patterns like ripples were found within the irradiated spot. Secondly, the processed depth was reduced by coexisting electrolyte in water. Thirdly, there were less residual aggregates or debris.

Paper Details

Date Published: 18 November 2003
PDF: 3 pages
Proc. SPIE 5063, Fourth International Symposium on Laser Precision Microfabrication, (18 November 2003); doi: 10.1117/12.540531
Show Author Affiliations
Kenji Katayama, Univ. of Tokyo (Japan)
Hideaki Yonekubo, Univ. of Tokyo (Japan)
Tsuguo Sawada, Univ. of Tokyo (Japan)


Published in SPIE Proceedings Vol. 5063:
Fourth International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Andreas Ostendorf; Koji Sugioka; Henry Helvajian, Editor(s)

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