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Proceedings Paper

Damping of polycrystalline Ni-Mn-Ga, bulk, PLD, and sputtered thin film
Author(s): David A. Ruggles; Eric Gans; Kotekar P. Mohanchandra; Gregory P. Carman; E. Ngo; W. Nothwang; M. W. Cole
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Paper Abstract

Polycrystalline Ni-Mn-Ga in bulk, pulsed laser deposition (PLD) thin film, and radio frequency (RF) sputtered thin film are studied. A thin film of direct current (DC) magnetron sputter deposited NiTi was also used in the study. A polycrystalline Ni-Mn-Ga bulk sample was measured to have a tan δ = 0.4925 and a maximum elastic modulus E = 7.3 GPa. Material characterization studies were performed on polycrystalline Ni-Mn-Ga thin films deposited by PLD onto single crystal (100) Si and (100) MgO substrates at substrate temperatures ranging from 550°C to 650°C. Damping measurements on RF sputter deposition of 1 μm Ni-Mn-Ga and 10 μm of NiTi both on copper substrates were performed in cantilever beam ring down tests. Results show 1 μm RF sputter deposited Ni-Mn-Ga thin film on a 54 μm copper substrate improves damping properties.

Paper Details

Date Published: 21 July 2004
PDF: 8 pages
Proc. SPIE 5387, Smart Structures and Materials 2004: Active Materials: Behavior and Mechanics, (21 July 2004); doi: 10.1117/12.540185
Show Author Affiliations
David A. Ruggles, Univ. of California/Los Angeles (United States)
Eric Gans, Univ. of California/Los Angeles (United States)
Kotekar P. Mohanchandra, Univ. of California/Los Angeles (United States)
Gregory P. Carman, Univ. of California/Los Angeles (United States)
E. Ngo, Army Research Lab. (United States)
W. Nothwang, Army Research Lab. (United States)
M. W. Cole, Army Research Lab. (United States)


Published in SPIE Proceedings Vol. 5387:
Smart Structures and Materials 2004: Active Materials: Behavior and Mechanics
Dimitris C. Lagoudas, Editor(s)

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