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Proceedings Paper

Frequency-agile wireless sensor networks
Author(s): Steven W. Arms; Christopher P. Townsend; David L. Churchill; Michael J. Hamel; Jacob H. Galbreath; Steven W. Mundell
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Paper Abstract

Our goal was to demonstrate a wireless communications system capable of simultaneous, high speed data communications from a variety of sensors. We have previously reported on the design and application of 2 KHz data logging transceiver nodes, however, only one node may stream data at a time, since all nodes on the network use the same communications frequency. To overcome these limitations, second generation data logging transceivers were developed with software programmable radio frequency (RF) communications. Each node contains on-board memory (2 Mbytes), sensor excitation, instrumentation amplifiers with programmable gains & offsets, multiplexer, 16 bit A/D converter, microcontroller, and frequency agile, bi-directional, frequency shift keyed (FSK) RF serial data link. These systems are capable of continuous data transmission from 26 distinct nodes (902-928 MHz band, 75 kbaud). The system was demonstrated in a compelling structural monitoring application. The National Parks Service requested a means for continual monitoring and recording of sensor data from the Liberty Bell during a move to a new location (Philadelphia, October 2003). Three distinct, frequency agile, wireless sensing nodes were used to detect visible crack shear/opening micromotions, triaxial accelerations, and hairline crack tip strains. The wireless sensors proved to be useful in protecting the Liberty Bell.

Paper Details

Date Published: 29 July 2004
PDF: 8 pages
Proc. SPIE 5389, Smart Structures and Materials 2004: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, (29 July 2004); doi: 10.1117/12.539925
Show Author Affiliations
Steven W. Arms, MicroStrain, Inc. (United States)
Christopher P. Townsend, MicroStrain, Inc. (United States)
David L. Churchill, MicroStrain, Inc. (United States)
Michael J. Hamel, MicroStrain, Inc. (United States)
Jacob H. Galbreath, MicroStrain, Inc. (United States)
Steven W. Mundell, MicroStrain, Inc. (United States)


Published in SPIE Proceedings Vol. 5389:
Smart Structures and Materials 2004: Smart Electronics, MEMS, BioMEMS, and Nanotechnology
Vijay K. Varadan, Editor(s)

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