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Proceedings Paper

Thermomechanical behavior of Cu-Al-Ni single crystal high-temperature shape memory alloy: reorientation
Author(s): Steve Trigwell; Ganesh Kumara Kannarpady; Abhijit Bhattacharyya; Sergei Pulnev; Ivan Vahhi
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Paper Abstract

Copper-Aluminum-Nickel (Cu-Al-Ni) single crystal shape memory alloy (SMA) wires show great potential in actuator applications due to their high stress-free transformation temperatures and superior mechanical stability compared to common Nickel-Titanium SMAs. In this paper, Cu-13.3%Al-4%Ni (wt %) single crystal wires with stress-free transformation temperatures in the range of 80° C to 120° C were subjected to stress cycling tests at ambient temperatures up to 100° C at low deformation rates. Stress/strain curves up to 9% and 3% strain in the range of the transformation temperatures point to the possibility of phase transformation by detwinning. However, the residual overall strain after unloading decreased significantly at 60° C for both 3% and 9% strains. Accumulation of plastic deformation was observed for subsequent cycles.

Paper Details

Date Published: 21 July 2004
PDF: 8 pages
Proc. SPIE 5387, Smart Structures and Materials 2004: Active Materials: Behavior and Mechanics, (21 July 2004); doi: 10.1117/12.539834
Show Author Affiliations
Steve Trigwell, Univ. of Arkansas at Little Rock (United States)
Ganesh Kumara Kannarpady, Univ. of Arkansas at Little Rock (United States)
Abhijit Bhattacharyya, Univ. of Arkansas at Little Rock (United States)
Sergei Pulnev, A.F. Ioffe Physico-Technical Institute (Russia)
Ivan Vahhi, St. Petersburg Polytechnic Univ. (Russia)


Published in SPIE Proceedings Vol. 5387:
Smart Structures and Materials 2004: Active Materials: Behavior and Mechanics
Dimitris C. Lagoudas, Editor(s)

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