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Proceedings Paper

Self-powered sensing for mechanical system condition monitoring
Author(s): Robert X. Gao; David O. Kazmer; Li Zhang; Charles B. Theurer; Yong Cui
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Paper Abstract

A self-powered wireless sensing module for the condition monitoring of mechanical systems and high energy manufacturing processes is described, with injection molding as a special application. The design and analysis of three constituent components in such a sensing module: an energy converter consisting of a piezoceramic stack, an energy regulator based on a pair of bipolar transistors, and a piezoelectric transmitter that transmits ultrasound signals proportional to the pressure within the injection mold, are presented in this paper. The energy extraction mechanism is investigated based on the interactions between the mechanical strain and the electric field developed within the piezoceramic stack. Analytical models for the energy modulator and signal transmitter are also established. Quantitative results are obtained that describe the energy flow among the three components and guide the parametric design of the three constituent components. Simulations and experimental studies have validated the functionality of each component. The models established can be used to subsequently optimize the design of the entire sensor module in terms of minimizing the energy requirement for the sensor and identifying the minimum level of signal intensity required to ensure successful detection of the signal by the signal receiver on the outside of the injection mold. The proposed self-powered sensing technique enables a new generation of sensors that can be employed for the condition monitoring and health diagnosis of a wide range of mechanical and civil systems that are characterized by high energy contents.

Paper Details

Date Published: 29 July 2004
PDF: 10 pages
Proc. SPIE 5391, Smart Structures and Materials 2004: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems, (29 July 2004); doi: 10.1117/12.539627
Show Author Affiliations
Robert X. Gao, Univ. of Massachusetts/Amherst (United States)
David O. Kazmer, Univ. of Massachusetts/Lowell (United States)
Li Zhang, Univ. of Massachusetts/Amherst (United States)
Charles B. Theurer, GE Global Research Ctr. (United States)
Yong Cui, Univ. of Massachusetts/Amherst (United States)

Published in SPIE Proceedings Vol. 5391:
Smart Structures and Materials 2004: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems
Shih-Chi Liu, Editor(s)

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