Share Email Print
cover

Proceedings Paper

Stress-strain behavior of Cu-Al-Ni single-crystal shape memory alloy at high temperature: shape memory effects
Author(s): Ganesh Kumara Kannarpady; Steve Trigwell; Abhijit Bhattacharyya; Ivan Viahhi; Sergei Pulnev
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The experimental results of a preliminary study on stress-strain behavior of Cu-13.3% Al- 4% Ni (by wt.) single crystal shape memory alloy grown along the [001] direction at high temperatures are given. An Instron testing machine with a high temperature environmental chamber has been used to study the quasi-static stress-strain response of 1.5 mm diameter Cu-Al-Ni single crystal wires at different ambient temperatures in the range 100 - 160°C. Local strain measurements using a highly sensitive extensometer are compared with overall strain measurements computed from the net displacements between grips. The effect of stress cycles on overall strain on full loading, after unloading and after heating in between stress cycles has been discussed.

Paper Details

Date Published: 21 July 2004
PDF: 7 pages
Proc. SPIE 5387, Smart Structures and Materials 2004: Active Materials: Behavior and Mechanics, (21 July 2004); doi: 10.1117/12.539558
Show Author Affiliations
Ganesh Kumara Kannarpady, Univ. of Arkansas at Little Rock (United States)
Steve Trigwell, Univ. of Arkansas at Little Rock (United States)
Abhijit Bhattacharyya, Univ. of Arkansas at Little Rock (United States)
Ivan Viahhi, St. Petersberg State Polytechnic Univ. (Russia)
Sergei Pulnev, Ioffe Physico-Technical Institute of Russian Academy of Science (Russia)


Published in SPIE Proceedings Vol. 5387:
Smart Structures and Materials 2004: Active Materials: Behavior and Mechanics
Dimitris C. Lagoudas, Editor(s)

© SPIE. Terms of Use
Back to Top