Share Email Print
cover

Proceedings Paper

Resonant-type MEMS transducers excited by two acoustic emission simulation techniques
Author(s): Didem Ozevin; David W. Greve; Irving J. Oppenheim; Stephen Pessiki
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Acoustic emission testing is a passive nondestructive testing technique used to identify the onset and characteristics of damage through the detection and analysis of transient stress waves. Successful detection and implementation of acoustic emission requires good coupling, high transducer sensitivity and ability to discriminate noise from real signals. We report here detection of simulated acoustic emission signals using a MEMS chip fabricated in the multi-user polysilicon surface micromachining (MUMPs) process. The chip includes 18 different transducers with 10 different resonant frequencies in the range of 100 kHz to 1 MHz. It was excited by two different source simulation techniques; pencil lead break and impact loading. The former simulation was accomplished by breaking 0.5 mm lead on the ceramic package. Four transducer outputs were collected simultaneously using a multi-channel oscilloscope. The impact loading was repeated for five different diameter ball bearings. Traditional acoustic emission waveform analysis methods were applied to both data sets to illustrate the identification of different source mechanisms. In addition, a sliding window Fourier transform was performed to differentiate frequencies in time-frequency-amplitude domain. The arrival and energy contents of each resonant frequency were investigated in time-magnitude plots. The advantages of the simultaneous excitation of resonant transducers on one chip are discussed and compared with broadband acoustic emission transducers.

Paper Details

Date Published: 29 July 2004
PDF: 11 pages
Proc. SPIE 5391, Smart Structures and Materials 2004: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems, (29 July 2004); doi: 10.1117/12.539538
Show Author Affiliations
Didem Ozevin, Lehigh Univ. (United States)
David W. Greve, Carnegie Mellon Univ. (United States)
Irving J. Oppenheim, Carnegie Mellon Univ. (United States)
Stephen Pessiki, Lehigh Univ. (United States)


Published in SPIE Proceedings Vol. 5391:
Smart Structures and Materials 2004: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems
Shih-Chi Liu, Editor(s)

© SPIE. Terms of Use
Back to Top