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Proceedings Paper

Stress analysis for the field near crack tip of bi-material beam by image distinction of the Isodyne pattern
Author(s): Yi Fu; Xinhua Ji; Yuwen Qin
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Paper Abstract

Interfacial Fracture Mechanics is the problem which attracted researchers all over the world as the strength of the composite structure are depended on the mechanical behavior of the interfacial fracture. In the paper, the stress field and stress intensity factor of a bi-material beam with crack is obtained by model with initial carrier fringes. In order to obtaining phase value of which is related to the stresses, the Fourier Transform method and frequency shift are applied. It is shown that, using this method, the research of interfacial crack can be more simple, efficient and highly accurate. This technique is very significance for the local three-dimensional effects in dynamic problems of interfacial fracture mechanics.

Paper Details

Date Published: 25 September 2003
PDF: 4 pages
Proc. SPIE 5286, Third International Symposium on Multispectral Image Processing and Pattern Recognition, (25 September 2003); doi: 10.1117/12.538988
Show Author Affiliations
Yi Fu, Tianjin Univ. (China)
Xinhua Ji, Tianjin Univ. (China)
Yuwen Qin, Tianjin Univ. (China)


Published in SPIE Proceedings Vol. 5286:
Third International Symposium on Multispectral Image Processing and Pattern Recognition
Hanqing Lu; Tianxu Zhang, Editor(s)

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