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Proceedings Paper

Determination of Local Stress Intensity Factor at Crack Tip Using Image Correlation Techniques
Author(s): Yi-Yang Tsai; Juergen Keller; Daniel Eylon; Dietmar Vogel; Bernd Michel; Norbert Meyendorf
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Paper Abstract

The extraordinary mechanical properties of high strength aluminum alloys such as AA7075-T6 are caused by coherent nanoprecipitations. These nanoprecipitations generate local stress fields and interact with moving dislocations and propagating microcracks. In this paper, image correlation techniques are used to determine the local strain and stress field in the vicinity of fatigue crack tips during the loading of compact tension (CT) specimen. The fatigue crack tip was sharpened with decreasing fatigue loading after fatigue cracks initial appearance. Images of the crack tip were taken using atomic force microscopy/ultrasonic force microscopy (AFM/UFM) and white light interference microscopy (WLIM) before and after mechanical loading of the specimen. Both techniques are applicable for measuring the out-of-plane displacement during the loading process. In addition, image correlation techniques can be used to determine the in-plane displacement resulting from mechanical loading. This information is used to calculate the local stress intensity factor in the vicinity of the crack tips.

Paper Details

Date Published: 21 July 2004
PDF: 7 pages
Proc. SPIE 5392, Testing, Reliability, and Application of Micro- and Nano-Material Systems II, (21 July 2004); doi: 10.1117/12.538757
Show Author Affiliations
Yi-Yang Tsai, Univ. of Dayton Research Institute (United States)
Juergen Keller, Fraunhofer-Institut fur Zuverlaessigkeit und Mikrointegration (Germany)
Daniel Eylon, Univ. of Dayton Research Institute (United States)
Dietmar Vogel, Fraunhofer-Institut fur Zuverlaessigkeit und Mikrointegration (Germany)
Bernd Michel, Fraunhofer-Institut fur Zuverlaessigkeit und Mikrointegration (Germany)
Norbert Meyendorf, Univ. of Dayton Research Institute (United States)


Published in SPIE Proceedings Vol. 5392:
Testing, Reliability, and Application of Micro- and Nano-Material Systems II
Norbert Meyendorf; George Y. Baaklini; Bernd Michel, Editor(s)

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