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Proceedings Paper

Combinitorial resist processing studies
Author(s): Carl E. Larson; Gregory M. Wallraff
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Paper Abstract

A new processing tool, the Thermal Gradient Plate (TGP) is described. The TGP allows for a range of temperatures to be expressed on a wafer or other substrate in a controlled and reproducible manner. Materials coated on a substrate can be baked across a range of temperatures, allowing multiple experiments to be run in parallel. Combining orthogonal TGP bakes creates a matrix of temperature pairs on a single wafer, allowing two bake step processes to be studied in a single experimental run. Experimental results demonstrating a variety of resist studies are described, including resist CD temperature dependence, underlayer cure temperature determination, and two bake step interactions.

Paper Details

Date Published: 14 May 2004
PDF: 9 pages
Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); doi: 10.1117/12.538684
Show Author Affiliations
Carl E. Larson, IBM Almaden Research Ctr. (United States)
Gregory M. Wallraff, IBM Almaden Research Ctr. (United States)


Published in SPIE Proceedings Vol. 5376:
Advances in Resist Technology and Processing XXI
John L. Sturtevant, Editor(s)

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