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Proceedings Paper

In-tool process control for advanced patterning based on integrated metrology
Author(s): David S. L. Mui; Hiroki Sasano; Wei Liu; John Yamartino; Andrew Skumanich
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Paper Abstract

Control on the order of a nanometer is crucial for present days advanced logic, SRAM, and DRAM integrated circuits (IC). This level of control is necessary to ensure proper functioning of these circuits. In logic and SRAM applications the most important control parameter is the critical dimension of the gate conductor and for DRAM deep trench it is the etch depth. Advanced Process Control (APC) using feedforward and feedback closed loop techniques have been implemented in fabs for over two decades. Up until recently most fabs have used standalone metrology tools exclusively to collect critical wafer parameters. In this paper, a fully integrated TransformaTM Closed Loop (CL) etch system is used to facilitate nanometer gate etch control by enabling, for the first time, real-time feedforward and feedback measurement on a gate etch process.

Paper Details

Date Published: 29 April 2004
PDF: 8 pages
Proc. SPIE 5378, Data Analysis and Modeling for Process Control, (29 April 2004); doi: 10.1117/12.537444
Show Author Affiliations
David S. L. Mui, Applied Materials (United States)
Hiroki Sasano, Applied Materials (United States)
Wei Liu, Applied Materials (United States)
John Yamartino, Applied Materials (United States)
Andrew Skumanich, Applied Materials (United States)


Published in SPIE Proceedings Vol. 5378:
Data Analysis and Modeling for Process Control
Kenneth W. Tobin, Editor(s)

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