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Proceedings Paper

Evaluation of the Imprio 100 Step and Flash Imprint Lithography tool
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Paper Abstract

Step and Flash Imprint Lithography (S-FIL) is one of several new methods of imprint lithography being actively developed. As with other nanoimprint methods, S-FIL resolution appears to be limited only by template resolution, and offers a significant cost of ownership reduction when compared to other NGL methods such as EUVL and 157 nm lithography. Market segments capable of being addressed with S-FIL technology include nanodevice fabrication, compound semiconductors, photonic and optical devices, data storage, and advanced packaging. Successful implementation will require a commercial supplier of S-FIL tools, as well as an infrastructure that will support fabrication of the necessary 1X templates. The Imprio 100, manufactured by Molecular Imprints, Inc. is the first commercially available S-FIL tool. The purpose of this paper is to describe the performance and capabilities of the Imprio 100. Performance related to several tool parameters including layer-to-layer overlay, pre-aligner precision, residual layer thickness and uniformity, resolution, wafer throughput, and exposure lamp intensity uniformity was evaluated. Several spin-coatable organic materials were evaluated for their efficacy as transfer layers. Contact angle analysis of each material along with a comparison of the spread time and resulting residual layer, and overall resolution using each material was also done. This paper will present the results of both the factory and site acceptance tests, and will also cover the imprinting capability of the tool.

Paper Details

Date Published: 20 May 2004
PDF: 11 pages
Proc. SPIE 5374, Emerging Lithographic Technologies VIII, (20 May 2004); doi: 10.1117/12.537380
Show Author Affiliations
Kathleen A. Gehoski, Motorola, Inc. (United States)
David P. Mancini, Motorola, Inc. (United States)
Douglas J. Resnick, Motorola, Inc. (United States)


Published in SPIE Proceedings Vol. 5374:
Emerging Lithographic Technologies VIII
R. Scott Mackay, Editor(s)

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