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Proceedings Paper

Liquid immersion lithography: evaluation of resist issues
Author(s): William Hinsberg; Gregory M. Wallraff; Carl E. Larson; Blake W. Davis; Vaughn Deline; Simone Raoux; Dolores Miller; Frances A. Houle; John Hoffnagle; Martha I. Sanchez; Charles Rettner; Linda K. Sundberg; David R. Medeiros; Ralph R. Dammel; Willard E. Conley
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Paper Abstract

We address in this report a set of key questions tied to the implementation of liquid immersion lithography, from the perspective of the resist materials. We discuss the broad question of whether chemically amplified resists are capable of achieving the spatial resolution that ultimately will be required for the most advanced immersion scenario. Initial studies undertaken using model 193 nm resist materials provide some insight into how an aqueous liquid immersion process can affect the resist material.

Paper Details

Date Published: 14 May 2004
PDF: 13 pages
Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); doi: 10.1117/12.536576
Show Author Affiliations
William Hinsberg, IBM Almaden Research Ctr. (United States)
Gregory M. Wallraff, IBM Almaden Research Ctr. (United States)
Carl E. Larson, IBM Almaden Research Ctr. (United States)
Blake W. Davis, IBM Almaden Research Ctr. (United States)
Vaughn Deline, IBM Almaden Research Ctr. (United States)
Simone Raoux, IBM Almaden Research Ctr. (United States)
Dolores Miller, IBM Almaden Research Ctr. (United States)
Frances A. Houle, IBM Almaden Research Ctr. (United States)
John Hoffnagle, IBM Almaden Research Ctr. (United States)
Martha I. Sanchez, IBM Almaden Research Ctr. (United States)
Charles Rettner, IBM Almaden Research Ctr. (United States)
Linda K. Sundberg, IBM Almaden Research Ctr. (United States)
David R. Medeiros, IBM Thomas J. Watson Research Ctr. (United States)
Ralph R. Dammel, Clariant Corp. (United States)
Willard E. Conley, Motorola, Inc. (United States)


Published in SPIE Proceedings Vol. 5376:
Advances in Resist Technology and Processing XXI
John L. Sturtevant, Editor(s)

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