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Proceedings Paper

Development of customer assistance software for alignment parameter optimization
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Paper Abstract

Wafer alignment plays a significant role in the advancement of microlithography and has been constantly improved to meet various situations. As a result, its configuration is very dynamic and it sometimes requires considerable cost for process optimization. Software has been developed which evaluates the alignment performance in a variety of conditions from the minimal data set. It allows the user to perform off-line optimization, essentially reducing the amount of interruption toward production. This article illustrates the simulation method implemented in the software, OverLay EValuation program (OLEV).

Paper Details

Date Published: 29 April 2004
PDF: 10 pages
Proc. SPIE 5378, Data Analysis and Modeling for Process Control, (29 April 2004); doi: 10.1117/12.536104
Show Author Affiliations
Yuho Kanaya, Nikon Corp. (Japan)
Shinichi Nakajima, Nikon Corp. (Japan)


Published in SPIE Proceedings Vol. 5378:
Data Analysis and Modeling for Process Control
Kenneth W. Tobin, Editor(s)

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