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Proceedings Paper

Time-based PEB adjustment for optimizing CD distributions
Author(s): Paul D. Friedberg; Cherry Tang; Bhanwar Singh; Thomas Brueckner; Wolfram Gruendke; Bernd Schulz; Costas J. Spanos
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Paper Abstract

In this paper we investigate the impact of bake plate temperature variability throughout the entire bake trajectory on resulting critical dimension. For a poorly-controlled bake plate, it is found that the correlation between the temperature profile and CD distribution is high throughout the entire bake cycle, including the steady state sector. However, for a well-controlled, multiple-zone bake plate, the correlation is only significant during the transient heating sector, since in those cases the steady state plate behavior has already been optimized for CDU performance. An estimate of the potential improvement yet to be gained by improvement of transient heating uniformity is calculated.

Paper Details

Date Published: 24 May 2004
PDF: 10 pages
Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004); doi: 10.1117/12.535871
Show Author Affiliations
Paul D. Friedberg, Univ. of California/Berkeley (United States)
Advanced Micro Devices, Inc. (United States)
Cherry Tang, Advanced Micro Devices, Inc. (United States)
Bhanwar Singh, Advanced Micro Devices, Inc. (United States)
Thomas Brueckner, Advanced Micro Devices, Inc. (Germany)
Wolfram Gruendke, Advanced Micro Devices, Inc. (Germany)
Bernd Schulz, Advanced Micro Devices, Inc. (Germany)
Costas J. Spanos, Univ. of California/Berkeley (United States)


Published in SPIE Proceedings Vol. 5375:
Metrology, Inspection, and Process Control for Microlithography XVIII
Richard M. Silver, Editor(s)

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