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Proceedings Paper

Evaporated resist for the fabrication and replication of LEEPL mask
Author(s): Melanie Cloutier; Yousef Awad; Eric Lavallee; David Turcotte; Jacques Beauvais; Dominique Drouin; Lau Kien Mun; Pan Yang; Pierre Lafrance; Ron Legario; Akira Yoshida; Hiroshi Nozue
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Paper Abstract

Masks for low energy electron proximity projection lithography (LEEPL) require thin membranes, which in turn make the development of low-distortion masks a critical issue for this technology. By using an evaporated resist, a flip side fabrication process is presented here in which mask patterning is carried out with the mask in the same orientation that it will have in the stepper. This new process reduces distortions of a typical LEEPL mask which usually requires patterning on the opposite side of the membrane causing a gravitational sag effects. In addition, an evaporated resist has significant advantages for mask fabrication as membrane distortion is reduced due to the absence of centrifugal force during the resist deposition process. Uniform heat distribution across the membrane during the etching process is also expected since the membrane can now be placed in direct contact with a cooled metal electrode, thereby improving the etch rate uniformity. Also, for large scale production, several mask replicates from the original mask must be made because they have limited lifetime when used in a stepper. Image placement distortion can be minimized and the yield can be improved in mask replication by using an evaporated resist.

Paper Details

Date Published: 20 May 2004
PDF: 8 pages
Proc. SPIE 5374, Emerging Lithographic Technologies VIII, (20 May 2004); doi: 10.1117/12.535747
Show Author Affiliations
Melanie Cloutier, Quantiscript Inc. (Canada)
Yousef Awad, Quantiscript Inc. (Canada)
Eric Lavallee, Quantiscript Inc. (Canada)
David Turcotte, Quantiscript Inc. (Canada)
Jacques Beauvais, Quantiscript Inc. (Canada)
Dominique Drouin, Quantiscript Inc. (Canada)
Lau Kien Mun, Quantiscript Inc. (Canada)
Pan Yang, Quantiscript Inc. (Canada)
Pierre Lafrance, Quantiscript Inc. (Canada)
Ron Legario, Quantiscript Inc. (Canada)
Akira Yoshida, LEEPL Corp. (Japan)
Hiroshi Nozue, LEEPL Corp. (Japan)


Published in SPIE Proceedings Vol. 5374:
Emerging Lithographic Technologies VIII
R. Scott Mackay, Editor(s)

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