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Proceedings Paper

Interaction of RET and MDP: optimization for reducing the mask writing time
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Paper Abstract

As the industry is targeting the sub-100nm nodes the pressure on the data path and tapeout flow is growing. Design complexity and increased deployment of resolution enhancement techniques (RET) result in rapidly growing file sizes, which impacts the data preparation time, especially for variable-shaped beam mask writing machines. Properties of the incoming layout - hierarchy, grid and aggressiveness of the RET are the main factors. Tuning the OPC without compromising the lithographic performance while achieving the shortest processing time is the target. The study investigates the impact of OPC setup with a focus on using the functional intent of the design to influence the aggressiveness of the correction. The correlation to the performance parameters for the mask data preparation and mask writing, like run-time, file size, shot count and small figures, will be reported.

Paper Details

Date Published: 3 May 2004
PDF: 12 pages
Proc. SPIE 5379, Design and Process Integration for Microelectronic Manufacturing II, (3 May 2004); doi: 10.1117/12.535653
Show Author Affiliations
James Word, Mentor Graphics Corp. (United States)
Steffen F. Schulze, Mentor Graphics Corp. (United States)


Published in SPIE Proceedings Vol. 5379:
Design and Process Integration for Microelectronic Manufacturing II
Lars W. Liebmann, Editor(s)

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