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Proceedings Paper

New BARC materials for the 65-nm node in 193-nm lithography
Author(s): Charles J. Neef; Vandana Krishnamurthy; Mariya I. Nagatkina; Evan Bryant; Michelle Windsor; Cheryl Nesbit
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Paper Abstract

New fast-etching bottom anti-reflective coatings have been prepared at Brewer Science, Inc., for 193-nm lithography. These materials, EXP03087B and EXP03066, were targeted for first and second reflectivity minima thickness, respectively. The optical constants (n and k) of these materials were 1.70 and 0.50, respectively, for EXP03087B and 1.71 and 0.31, respectively, for EXP03066. After thermosetting, these materials were immiscible with photoresists and were not affected by base developer. Profiles utilizing these BARCs with JSR's AR1221J photoresist have shown 90-nm (l:l line space) dense lines and 100-nm lines with FFA’s GAR8105G1 resist.

Paper Details

Date Published: 14 May 2004
PDF: 5 pages
Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); doi: 10.1117/12.535423
Show Author Affiliations
Charles J. Neef, Brewer Science, Inc. (United States)
Vandana Krishnamurthy, Brewer Science, Inc. (United States)
Mariya I. Nagatkina, Brewer Science, Inc. (United States)
Evan Bryant, Brewer Science, Inc. (United States)
Michelle Windsor, Brewer Science, Inc. (United States)
Cheryl Nesbit, Brewer Science, Inc. (United States)

Published in SPIE Proceedings Vol. 5376:
Advances in Resist Technology and Processing XXI
John L. Sturtevant, Editor(s)

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