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Proceedings Paper

Specification of the phase angle of a 6% attenuated PSM mask used in ArF lithography
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Paper Abstract

As 6% attenuated phase shift masks (PSM) become commonly used in ArF advanced lithography for the 90nm Technology and mass production to print lines/ spaces as well as contacts, the specification and control of the phase angle and the width of the distribution of phase angles becomes critical to maintain the quality of the lithography process. The influence of the mean phase angle and the width of the distribution of phase angles on the best focus, the through pitch behavior and uniformity of the critical dimension (CD uniformity) has been studied experimentally using a 6% attenuated PSM whose phase angle has been affected by several reticle cleans. The results are consistent with aerial image simulations. Independent specifications for the mean phase angle and the width of the distribution of phase angles have been derived and could be applied for the production of masks in the future.

Paper Details

Date Published: 28 May 2004
PDF: 9 pages
Proc. SPIE 5377, Optical Microlithography XVII, (28 May 2004); doi: 10.1117/12.535167
Show Author Affiliations
Ching-Hsu Chang, United Microelectronics Corp. (Taiwan)
Jochen Schacht, Infineon Technologies AG (Germany)
Benjamin Szu-Min Lin, United Microelectronics Corp. (Taiwan)
Kuei-Chun Hung, United Microelectronics Corp. (Taiwan)
I. Hsuing Huang, United Microelectronics Corp. (Taiwan)


Published in SPIE Proceedings Vol. 5377:
Optical Microlithography XVII
Bruce W. Smith, Editor(s)

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