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Proceedings Paper

Productivity and yield improvement through implementation of automated defect review SEM at 45° column tilt in a high-capacity production Fab
Author(s): Jackie Tan; Sandeep Kulkarni; Sern Loong Ng; Alok Jain; Vish Srinivasan; Nurit Raccah; Ofer Rotlevi
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Paper Abstract

As Integrated Circuit (IC) manufacturing moves towards smaller design rules and shorter product life cycles, the automatic application of Scanning Electron Microscopy (SEM) becomes more critical in advanced wafer fabrication processes. In most of the advanced IC manufacturers, automatic SEM defect review has been integrated into the IC fabrication process flow. Hence, a review methodology that can provide faster, accurate and reliable information on the yield limiting defects in an automated way, will definitely reduce the time to root cause analysis and thus improve yield and fab productivity. This paper provides a study of how the fab productivity was improved through the implementation of 45°-tilt Automatic Defect Re-detection (ADR) using the in-line defect review Applied Materials SEMVision. In addition to automatic review benefits, using the 45°-tilt capability also provides extra information necessary for root-cause analysis and yield improvement.

Paper Details

Date Published: 24 May 2004
PDF: 9 pages
Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004); doi: 10.1117/12.534872
Show Author Affiliations
Jackie Tan, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Sandeep Kulkarni, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Sern Loong Ng, Applied Materials South East Asia, Ltd. (Singapore)
Alok Jain, Applied Materials South East Asia, Ltd. (Singapore)
Vish Srinivasan, Applied Materials South East Asia, Ltd. (Singapore)
Nurit Raccah, Applied Materials Israel (Israel)
Ofer Rotlevi, Applied Materials Israel (Israel)


Published in SPIE Proceedings Vol. 5375:
Metrology, Inspection, and Process Control for Microlithography XVIII
Richard M. Silver, Editor(s)

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