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Proceedings Paper

Progress in the ASML EUV program
Author(s): Hans Meiling; Vadim Banine; Peter Kuerz; Noreen Harned
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Paper Abstract

ASML has continued to make significant investments in the development of extreme ultraviolet lithography (EUVL), addressing the critical challenges, including defect-free mask handling, reflective optics technology, environmental control, and source. We present updates in these key areas and in the realization of our process development exposure tool. This tool is used to minimize the risk of EUVL for the 45-nm technology node and below, and to support the development of the global infrastructure of masks, sources, and resist. Realization of the process development tool is well underway; most of the modules are in vacuum qualification and functional testing. From arial image simulations, we conclude that EUVL tools are particularly suited for contact printing, due to the use of dark-field masks, and hence, limited influence of flare.

Paper Details

Date Published: 20 May 2004
PDF: 12 pages
Proc. SPIE 5374, Emerging Lithographic Technologies VIII, (20 May 2004); doi: 10.1117/12.534784
Show Author Affiliations
Hans Meiling, ASML (Netherlands)
Vadim Banine, ASML (Netherlands)
Peter Kuerz, Carl Zeiss SMT AG (Germany)
Noreen Harned, ASML Netherlands B.V. (Netherlands)


Published in SPIE Proceedings Vol. 5374:
Emerging Lithographic Technologies VIII
R. Scott Mackay, Editor(s)

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