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Proceedings Paper

High etch rate ArF BARC composed of polyester
Author(s): Young Sun Hwang; Jae Chang Jung; Keun Do Ban; Sarohan Park; Cheol Kyu Bok; Seung Chan Moon; Ki Soo Shin
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Paper Abstract

As the pattern size decreases, the thickness of resist also should be decreased owing to the pattern collapse problem. So the using of surfactant containing rinse material, instead of DI water, can be a solution to the collapse problem. The developing of Bottom Anti Reflective Coating (BARC) that has high etch rate will be helpful to the collapse issue because it enables low thickness resist process and pattern collapse will be decrease. In this paper, Polyacetal, polyacrylate and polyesters BARCs were evaluated. Polyacetal type BARC shows best coating property. Regardless of the topology, polyacetal type BARC shows good conformality. However, polyacrylate and polyesters show coating fail on the topology wafer. In terms of pattern collapse, polyacetal type BARC also shows best results. Among the three types of BARC, ArF BARC that is made by polyester resin shows highest etch rate after 2000ÅBRAC etch. However, when the etching target is 60nm, all BARCs have same etch rate. For the matching with line and space resist, all these three BARCs show good profile. However, polyester type BARC does not match with contact hole resist and could not define contact hole pattern.

Paper Details

Date Published: 14 May 2004
PDF: 6 pages
Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); doi: 10.1117/12.534763
Show Author Affiliations
Young Sun Hwang, Hynix Semiconductor Inc. (South Korea)
Jae Chang Jung, Hynix Semiconductor Inc. (South Korea)
Keun Do Ban, Hynix Semiconductor Inc. (South Korea)
Sarohan Park, Hynix Semiconductor Inc. (South Korea)
Cheol Kyu Bok, Hynix Semiconductor Inc. (South Korea)
Seung Chan Moon, Hynix Semiconductor Inc. (South Korea)
Ki Soo Shin, Hynix Semiconductor Inc. (South Korea)


Published in SPIE Proceedings Vol. 5376:
Advances in Resist Technology and Processing XXI
John L. Sturtevant, Editor(s)

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