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Proceedings Paper

Target noise in overlay metrology
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Paper Abstract

We have developed a method for calculating the statistical effects of spatial noise on the overlay measurement extracted from a given overlay target. The method has been applied to two kinds of overlay targets on three process layers, and the new metric, Target Noise, has been shown to correlate well to the random component of Overlay Mark Fidelity. A significant difference in terms of robustness has been observed between AIM targets and conventional Frame-in-Frame targets. The results fit well into the spatial noise hierarchy presented in this paper.

Paper Details

Date Published: 24 May 2004
PDF: 10 pages
Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004); doi: 10.1117/12.534515
Show Author Affiliations
Joel L. Seligson, KLA-Tencor Corp. (Israel)
Mike E. Adel, KLA-Tencor Corp. (Israel)
Pavel Izikson, KLA-Tencor Corp. (Israel)
Vladimir Levinski, KLA-Tencor Corp. (Israel)
Dan Yaffe, KLA-Tencor Corp. (Israel)


Published in SPIE Proceedings Vol. 5375:
Metrology, Inspection, and Process Control for Microlithography XVIII
Richard M. Silver, Editor(s)

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