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Proceedings Paper

Production of novel materials for 157-nm and 193-nm soft pellicles
Author(s): Paul A. Zimmerman; Chris van Peski; Daniel Miller; Ryan P. Callahan; Matthew Cashion
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Paper Abstract

The introduction of 157nm lithography has raised many issues, not the least of which is the requirement of a new material for soft pellicle. At 157nm, the incident energy of 7.9 eV is enough to break any single organic bond. This makes the design of a soft pellicle material quite a challenge. Additionally, previous work in the industry has shown that improving transparency does not necessarily translate into longer pellicle lifetimes. Based on extensive investigation of how existing materials are degrading in the VUV, these new polymer systems have been produced. This study shares detailed structural information about several novel materials developed for use as soft pellicles. Additionally, data is shown for material properties including transmission and lifetime of films under 157 nm and 193 nm exposures.

Paper Details

Date Published: 28 May 2004
PDF: 7 pages
Proc. SPIE 5377, Optical Microlithography XVII, (28 May 2004); doi: 10.1117/12.534350
Show Author Affiliations
Paul A. Zimmerman, International SEMATECH (United States)
Chris van Peski, International SEMATECH (United States)
Daniel Miller, International SEMATECH (United States)
Ryan P. Callahan, Univ. of Texas at Austin (United States)
Matthew Cashion, Univ. of Texas at Austin (United States)


Published in SPIE Proceedings Vol. 5377:
Optical Microlithography XVII
Bruce W. Smith, Editor(s)

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