Share Email Print
cover

Proceedings Paper

Developer-soluble gap fill materials for patterning metal trenches in via-first dual-damascene process
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

This paper discusses a novel approach of using a developer-soluble gap fill material, wherein the gap fill material is coated in a layer thick enough to planarize all the topography and is then recessed using a standard 0.26N TMAH developer. The material recess process takes place in the same coater track where it is coated and therefore simplifies the process and increases wafer throughput. Performance and properties of two types of developer-soluble gap fill materials (EXP03049 and NCA2528) based on two different polymer platforms will be discussed in detail.

Paper Details

Date Published: 14 May 2004
PDF: 8 pages
Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); doi: 10.1117/12.534338
Show Author Affiliations
Mandar Bhave, Brewer Science, Inc. (United States)
Kevin Edwards, Brewer Science, Inc. (United States)
Carlton A. Washburn, Brewer Science, Inc. (United States)
Satoshi Takei, Nissan Chemical Industries, Ltd. (Japan)
Yasushi Sakaida, Nissan Chemical Industries, Ltd. (Japan)
Yasuyuki Nakajima, Nissan Chemical Industries, Ltd. (Japan)


Published in SPIE Proceedings Vol. 5376:
Advances in Resist Technology and Processing XXI
John L. Sturtevant, Editor(s)

© SPIE. Terms of Use
Back to Top