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Proceedings Paper

Calibration of OPC models for multiple focus conditions
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Paper Abstract

Ability to predict process behavior under defocus has until now relied on explicit calculations, which while accurate, cannot be realistically used in full-chip optical and process correction strategies due to the long run times. In this work, we have applied a vector model for the optics, and a compact model for the resist development process. Simulations with these models are fast enough to be the basis of full-chip OPC. We verify this strategy with an independent set of measurements, and compare it to current lithographic process fitting strategies. The results indicate that by describing optical processes as accurately as possible, the model accuracy improves over a wider range of defocus conditions when compared to the traditional calibration method. As long as the calibration process successfully decouples optical and resist effects, relatively simple resist models deliver excellent accuracy within the noise level of the metrology measurements. Our data are based on one-dimensional and two-dimensional results using a 193nm system using 0.75 NA and off axis illumination with 6% attenuated phase shift mask. In all cases, a wide variety of sub-resolution assist feature rules were used in order to further test the ability of the models to predict various optical and resist environments.

Paper Details

Date Published: 28 May 2004
PDF: 12 pages
Proc. SPIE 5377, Optical Microlithography XVII, (28 May 2004); doi: 10.1117/12.534123
Show Author Affiliations
Jochen Schacht, Infineon Technologies (Taiwan)
Klaus Herold, Infineon Technologies (Taiwan)
Rainer Zimmermann, Infineon Technologies (Taiwan)
J. Andres Torres, Mentor Graphics Corp. (United States)
Wilhelm Maurer, Mentor Graphics Corp. (United States)
Yuri Granik, Mentor Graphics Corp. (United States)
Ching-Hsu Chang, United Microelectronics Corp. (Taiwan)
G. Kuei-Chun Hung, United Microelectronics Corp. (Taiwan)
Benjamin Szu-Min Lin, United Microelectronics Corp. (Taiwan)


Published in SPIE Proceedings Vol. 5377:
Optical Microlithography XVII
Bruce W. Smith, Editor(s)

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