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Proceedings Paper

Influence of resin properties to resist performance at ArF lithography
Author(s): Sangwoong Yoon; Myungsun Kim; Hong Lee; Do Young Kim; Young Hoon Kim; Boo Deuk Kim; Jae Hyun Kim; Kyung-Mee Kim; Shi Yong Lee; Young Ho Kim; Sang-Mun Chon
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Paper Abstract

The ArF resist has been evaluated focusing on resin character such as molecular weight, monomer composition and polydispersity (Pd). The resin properties were investigated to elucidate that which parameter was affected to the line edge roughness (LER). The Pd was correlated with LER. As the Pd was large, the LER was small. The resin molecular weight and monomer composition were affected to their vertical profile. Low molecular weight portion rich resin resulted in round and t-top profile, whilst high molecular weight rich resin resulted in square profile. The amount of lower molecular weight fraction was changed by purification method. The lower molecular weight resin caused severe tapered profile. It was concluded that 1) shift of Mw to smaller and 2) higher content of low molecular size fraction lead to rounded and tapered pattern profile. Lot-to-lot stable good pattern profile has achieved by controlling polymer molecular weight and content of low molecular size fraction in small variation range.

Paper Details

Date Published: 14 May 2004
PDF: 8 pages
Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); doi: 10.1117/12.533950
Show Author Affiliations
Sangwoong Yoon, Samsung Electronics Co., Ltd. (South Korea)
Myungsun Kim, Samsung Electronics Co., Ltd. (South Korea)
Hong Lee, Samsung Electronics Co., Ltd. (South Korea)
Do Young Kim, Samsung Electronics Co., Ltd. (South Korea)
Young Hoon Kim, Samsung Electronics Co., Ltd. (South Korea)
Boo Deuk Kim, Samsung Electronics Co., Ltd. (South Korea)
Jae Hyun Kim, Samsung Electronics Co., Ltd. (South Korea)
Kyung-Mee Kim, Samsung Electronics Co., Ltd. (South Korea)
Shi Yong Lee, Samsung Electronics Co., Ltd. (South Korea)
Young Ho Kim, Samsung Electronics Co., Ltd. (South Korea)
Sang-Mun Chon, Samsung Electronics Co., Ltd. (South Korea)


Published in SPIE Proceedings Vol. 5376:
Advances in Resist Technology and Processing XXI
John L. Sturtevant, Editor(s)

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