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Proceedings Paper

BIORESIST: a lithographic approach for the patterning of cells in tissue engineering applications
Author(s): Wei He; Kenneth E. Gonsalves; Craig R. Halberstadt; Yusif Umar; Jae-Hak Choi
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Paper Abstract

Due to the involvement of organic solvents and strong bases in the pattern development process, conventional lithography, a technique that has been well-developed and widely used in the semiconductor industry, is not suitable for direct cell and protein patterning. In order to address this issue, we recently developed a biocompatible chemically amplified photoresist, BIORESIST, with which patterns can be generated without involving any harsh chemical treatment. Such a BIORESIST contains tert-butoxycarbonyl (t-BOC) protecting groups. In vitro cell culture study has shown that the t-BOC protected BIORESIST and its carboxyl-substituted counter-part interact very differently with cells. The former is non-cell adhesive, while the latter not only keeps cell attached, but also supports cell proliferation. This unique property prompted us to generate patterns (25 μm L/S) with this BIORESIST with no wet development involved. Rat fibroblast cells were cultured on the patterned surfaces. The results demonstrated that cells were strongly aligned along the patterns and attached exclusively to the adhesive region as opposed to a random appearance on the plain control surface after 24 hr of incubation. With this BIORESIST, the scalability aspect of conventional lithography could be well applied for cell patterning.

Paper Details

Date Published: 14 May 2004
PDF: 6 pages
Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); doi: 10.1117/12.533367
Show Author Affiliations
Wei He, Univ. of Connecticut (United States)
Kenneth E. Gonsalves, Univ. of North Carolina/Charlotte (United States)
Craig R. Halberstadt, Carolinas Medical Ctr. (United States)
Yusif Umar, Univ. of North Carolina/Charlotte (United States)
Jae-Hak Choi, Univ. of North Carolina/Charlotte (United States)

Published in SPIE Proceedings Vol. 5376:
Advances in Resist Technology and Processing XXI
John L. Sturtevant, Editor(s)

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