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Proceedings Paper

Production of low-thermal-expansion EUVL mask blanks with low-defect multilayer, buffer, and absorber
Author(s): Frank Sobel; Lutz Aschke; Frauke Rueggeberg; Holger Seitz; Nathalie Olschewski; Torsten Reichhardt; Hans Becker; Markus Renno; Steffen Kirchner; Thomas Leutbecher; Guenter Hess; Konrad Knapp
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Paper Abstract

Schott Lithotec has introduced all relevant technology steps to manufacture EUV mask blanks - ranging from Low Thermal Expansion Material (LTEM) via high quality substrate polishing to low defect blank manufacturing. New polishing and cleaning technologies, improved sputter technology and updated metrology enable us to routinely produce EUVL mask blanks meeting already many of the roadmap requirements. The goal is pilot production of EUV blanks for the 45 nm node end of 2005. There are several technology options for achieving the mechanical, optical and chemical specs for substrates and coatings. Some of them are already integrated in our processes. An important focus of this paper is the understanding of defect sources starting from the LTEM bulk material to the fully coated blanks with multilayer, buffer and absorber. We present details on some production steps controlling defect detection sensitivity dedicated to various layers and report on new results on defect reduction research after the different process steps.

Paper Details

Date Published: 20 May 2004
PDF: 12 pages
Proc. SPIE 5374, Emerging Lithographic Technologies VIII, (20 May 2004); doi: 10.1117/12.533292
Show Author Affiliations
Frank Sobel, Schott Lithotec AG (Germany)
Lutz Aschke, Schott Lithotec AG (Germany)
Frauke Rueggeberg, Schott Lithotec AG (Germany)
Holger Seitz, Schott Lithotec AG (Germany)
Nathalie Olschewski, Schott Lithotec AG (Germany)
Torsten Reichhardt, Schott Lithotec AG (Germany)
Hans Becker, Schott Lithotec AG (Germany)
Markus Renno, Schott Lithotec AG (Germany)
Steffen Kirchner, Schott Lithotec AG (Germany)
Thomas Leutbecher, Schott Lithotec AG (Germany)
Guenter Hess, Schott Lithotec AG (Germany)
Konrad Knapp, Schott Lithotec AG (Germany)

Published in SPIE Proceedings Vol. 5374:
Emerging Lithographic Technologies VIII
R. Scott Mackay, Editor(s)

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