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Proceedings Paper

Lead-free technologies for electronic equipment assembly
Author(s): Ryszard Kisiel
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Paper Abstract

The electronic industry is now going through a difficult period. The companies must cut costs, regroup and innovate. Environmentally friendly production from cradle-to-grave can be an essential element of future manufacturing trends. Recognizing leaf-free technology implementation it is necessary to consider the following elements: solder, printed circuit board and component finish or assembly technology. In the paper, the [hysical properties of chosen Pb-free solders were presented. There were analyzed the advantages and disadvantages of two PCB assembly methods: lead free soldering and gluing by condictive adhesive. The comparison of electrical and mechanical properties of joints made by Pb-free solders and two types of conductive adhesives were presented too. It was concluded that the exploitation parameters of joints made by Pb-free solders are proper for PCB assembly. Conductive adhesives may replace solders in these applications were the low value of joint resistance is not critical.

Paper Details

Date Published: 24 October 2003
PDF: 5 pages
Proc. SPIE 5125, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments, (24 October 2003); doi: 10.1117/12.532363
Show Author Affiliations
Ryszard Kisiel, Warsaw Univ. of Technology (Poland)


Published in SPIE Proceedings Vol. 5125:
Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments
Ryszard S. Romaniuk; Krzysztof T. Pozniak, Editor(s)

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