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Proceedings Paper

Single-pulse microvia drilling of resin-coated copper substrates using an enhanced peak power planar waveguide CO2 laser
Author(s): Colin J Moorhouse; Francisco Villarreal; Jozef J Wendland; Howard J Baker; Denis R Hall; Duncan P. Hand
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Paper Abstract

CO2 laser drilling of the resin coated copper (RCC) layers of laminated circuit boards has been investigated at different fluence levels. The threshold fluence for copper layer drilling is found to be 570 Jcm-2 for 5μm and 1500 Jcm-2 for 12μm copper thickness, using laser pulses in the 10 μs and 20 μs FWHM respectively. Undercut in the resin layer is found to primarily depend on the amount of excess energy in the pulse tail. Methods to reduce the pulse decay time have been investigated, giving smaller diameter breakthrough holes close to threshold, which should aid the control of hole drilling in RCC. High-speed videography has been used to verify the observations of post-processing analysis.

Paper Details

Date Published: 15 July 2004
PDF: 8 pages
Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); doi: 10.1117/12.532310
Show Author Affiliations
Colin J Moorhouse, Heriot-Watt Univ. (United Kingdom)
Francisco Villarreal, Heriot-Watt Univ. (United Kingdom)
Jozef J Wendland, Heriot-Watt Univ. (United Kingdom)
Howard J Baker, Heriot-Watt Univ. (United Kingdom)
Denis R Hall, Heriot-Watt Univ. (United Kingdom)
Duncan P. Hand, Heriot-Watt Univ. (United Kingdom)


Published in SPIE Proceedings Vol. 5339:
Photon Processing in Microelectronics and Photonics III
Jan J. Dubowski; David B. Geohegan; Frank Träger; Peter R. Herman; Jim Fieret; Alberto Pique; Tatsuo Okada; Friedrich G. Bachmann; Willem Hoving; Kunihiko Washio; Xianfan Xu, Editor(s)

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