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Proceedings Paper

Influence of gas on cutting silicon with solid state laser
Author(s): Udo Klotzbach; Stephanie Maelzer; Thomas Kuntze; Michael Panzner; Michael Doetschel; F. Sonntag; Eckhard Beyer
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Paper Abstract

For more than three decades the tool "laser" is used for cutting various materials. Thanks to its high degree of flexibility the laser nowadays becomes a real competitor to existing silicon wafer separating methods in semiconductor industry like grinding with dicing saws. Presently, laser micro maching of silicon wafers is done by solid state lasers with 1064nm or 532nm, processing with 355nm is increasingly investigated [5]. Especially the influence of the gas atmosphere on cutting speed and achievable quality is to be discussed in this paper.

Paper Details

Date Published: 15 July 2004
PDF: 6 pages
Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); doi: 10.1117/12.532133
Show Author Affiliations
Udo Klotzbach, Fraunhofer-Institut fuer Werkstoff- und Strahltechnik (Germany)
Stephanie Maelzer, Fraunhofer-Institut fuer Werkstoff- und Strahltechnik (Germany)
Thomas Kuntze, Fraunhofer-Institut fuer Werkstoff- und Strahltechnik (Germany)
Michael Panzner, Fraunhofer-Institut fuer Werkstoff- und Strahltechnik (Germany)
Michael Doetschel, Fraunhofer-Institut fuer Werkstoff- und Strahltechnik (Germany)
F. Sonntag, Fraunhofer-Institut fuer Werkstoff- und Strahltechnik (Germany)
Eckhard Beyer, Fraunhofer-Institut fuer Werkstoff- und Strahltechnik (Germany)


Published in SPIE Proceedings Vol. 5339:
Photon Processing in Microelectronics and Photonics III
Jan J. Dubowski; Peter R. Herman; Friedrich G. Bachmann; Willem Hoving; Jim Fieret; David B. Geohegan; Frank Träger; Kunihiko Washio; Alberto Pique; Xianfan Xu; Tatsuo Okada, Editor(s)

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