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Proceedings Paper

LBNL four-side buttable CCD package development
Author(s): Hakeem M. Oluseyi; John H. Bercovitz; Armin Karcher; Christopher D. Hernikl; Tom Miller; Michela Uslenghi; Natalie Roe; Chris Bebek; Stephen E. Holland; Michael E. Levi
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Paper Abstract

We have developed a precision, 4-side buttable CCD package for 2kx2k and 2kx4k format devices with minimal mechanical stress on the CCD, excellent thermal properties, reliable electrical connectivity, and shim-free mounting. We report on the package design, assembly and quality assurance procedures, measurements of packaged device flatness and flatness excursions when cooled from room temperature to 140 K, package performance and plans for future development.

Paper Details

Date Published: 7 June 2004
PDF: 12 pages
Proc. SPIE 5301, Sensors and Camera Systems for Scientific, Industrial, and Digital Photography Applications V, (7 June 2004); doi: 10.1117/12.531954
Show Author Affiliations
Hakeem M. Oluseyi, Lawrence Berkeley National Lab. (United States)
John H. Bercovitz, Lawrence Berkeley National Lab. (United States)
Armin Karcher, Lawrence Berkeley National Lab. (United States)
Christopher D. Hernikl, Lawrence Berkeley National Lab. (United States)
Tom Miller, Lawrence Berkeley National Lab. (United States)
Michela Uslenghi, Lawrence Berkeley National Lab. (United States)
Natalie Roe, Lawrence Berkeley National Lab. (United States)
Chris Bebek, Lawrence Berkeley National Lab. (United States)
Stephen E. Holland, Lawrence Berkeley National Lab. (United States)
Michael E. Levi, Lawrence Berkeley National Lab. (United States)


Published in SPIE Proceedings Vol. 5301:
Sensors and Camera Systems for Scientific, Industrial, and Digital Photography Applications V
Nitin Sampat; Morley M. Blouke; Ricardo J. Motta, Editor(s)

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